Trending...
- Webinar Announcement: Mexico's Evolving AML/CFT Environment: FATF Review and FTO Designations
- City of New Rochelle Unveils Updated GreeNR Plan, Advancing Strategies for Climate Resilience and Ad
- Hart Orthopedics: Elevating Orthopedic Care for the Long Island Community Massapequa, NY
TEMPE, Ariz. - Nyenta -- Recent testing: initial contact angles of 45 degrees to 75 degrees were measured. After plasma treatment in our AutoGlow 1000 the contact angle was measured < 2 degrees. Testing performed in the AutoGlow 1000 production plasma cleaner.
Plasma Treatment is used to modify silicon wafer surface properties, specifically targeting hydrophilicity. This process involves exposing the silicon substrate to a low-pressure plasma environment, typically utilizing gases such as oxygen or argon/hydrogen mixture. Through the interaction between plasma species and the silicon surface, a cascade of intricate chemical reactions occurs, leading to the formation of hydrophilic functional groups, primarily hydroxyl (-OH) moieties, on the surface.
The plasma-induced surface modification proceeds through sequential steps. Initially, energetic plasma species, including ions, electrons, and radicals, impact the silicon surface, breaking surface bonds--forming reactive species like silicon radicals and dangling bonds. Subsequently, these species react with surrounding gas molecules, predominantly oxygen or hydrogen, resulting in the incorporation of oxygen or hydrogen atoms onto the silicon surface.
More on Nyenta.com
The introduction of these functional groups, notably hydroxyl (-OH) groups, alters the silicon wafer's surface chemistry, rendering it hydrophilic. Hydroxyl groups exhibit a strong affinity for water molecules due to their polar nature, facilitating water adsorption and enhancing surface wetting. This transition, from hydrophobic to hydrophilic surfaces, holds significant importance in various technological domains, notably microfluidics, where precise control over surface wettability is vital for fluid manipulation and bioanalytical applications. Also important for bonding applications.
In semiconductor manufacturing, plasma treatment is particularly relevant for enhancing adhesion between silicon surfaces and functional layers like dielectric films or photoresists, thereby improving device performance and reliability. Moreover, the ability to tailor surface properties at the nanoscale level enables the fabrication of advanced nanostructures and surface patterns, paving the way for the development of innovative electronic and photonic devices.
More on Nyenta.com
Plasma treatment emerges as a sophisticated methodology, offering unparalleled precision in tailoring silicon wafer surfaces. Our test show results to increase the hydrophilic surfaces to reducing contact angles. Plasma treatment plays a pivotal role in various applications such as increasing bonding strength.
Testing was performed on the AutoGlow 1000 plasma system configured for RIE and Direct Plasma.
Plasma Treatment is used to modify silicon wafer surface properties, specifically targeting hydrophilicity. This process involves exposing the silicon substrate to a low-pressure plasma environment, typically utilizing gases such as oxygen or argon/hydrogen mixture. Through the interaction between plasma species and the silicon surface, a cascade of intricate chemical reactions occurs, leading to the formation of hydrophilic functional groups, primarily hydroxyl (-OH) moieties, on the surface.
The plasma-induced surface modification proceeds through sequential steps. Initially, energetic plasma species, including ions, electrons, and radicals, impact the silicon surface, breaking surface bonds--forming reactive species like silicon radicals and dangling bonds. Subsequently, these species react with surrounding gas molecules, predominantly oxygen or hydrogen, resulting in the incorporation of oxygen or hydrogen atoms onto the silicon surface.
More on Nyenta.com
- Charleston, SC - ACSEC offers Rain Barrels Through Annual Program
- Greek Government Issues Landmark Ministerial Order Addressing Citizenship of Greek-born adoptees
- HEAVY HITTERS Support Two Dog Rescues in Huntington, NY
- Baltimore Author Crafts Space Opera Where Human Questions Outshine Galactic Scale
- Stout Surpasses 60,000 Acres and 3 Billion Plants Scanned
The introduction of these functional groups, notably hydroxyl (-OH) groups, alters the silicon wafer's surface chemistry, rendering it hydrophilic. Hydroxyl groups exhibit a strong affinity for water molecules due to their polar nature, facilitating water adsorption and enhancing surface wetting. This transition, from hydrophobic to hydrophilic surfaces, holds significant importance in various technological domains, notably microfluidics, where precise control over surface wettability is vital for fluid manipulation and bioanalytical applications. Also important for bonding applications.
In semiconductor manufacturing, plasma treatment is particularly relevant for enhancing adhesion between silicon surfaces and functional layers like dielectric films or photoresists, thereby improving device performance and reliability. Moreover, the ability to tailor surface properties at the nanoscale level enables the fabrication of advanced nanostructures and surface patterns, paving the way for the development of innovative electronic and photonic devices.
More on Nyenta.com
- OpsVeda Announces Launch of TariffSight, the World's First Comprehensive Platform to Address Tariff-Driven Challenges
- MAJOR New release of Krypto500 (ELF-HF) Sigint - COMINT software
- New York Dental Practice Grows: Dr. Riley Reardon Joins the CPW Smile Team
- New Build-to-Suit VA Medical Office Facility Coming to Highland Heights, KY
- World Chess and the Algorand Foundation propose leveling the playing field with a "chess passport" USA - English USA - English
Plasma treatment emerges as a sophisticated methodology, offering unparalleled precision in tailoring silicon wafer surfaces. Our test show results to increase the hydrophilic surfaces to reducing contact angles. Plasma treatment plays a pivotal role in various applications such as increasing bonding strength.
Testing was performed on the AutoGlow 1000 plasma system configured for RIE and Direct Plasma.
Source: Glow Research
Filed Under: Technology
0 Comments
Latest on Nyenta.com
- Rochester: Public meetings and the solicitation of input: 2025-29 Consolidated Plan & FY 2025-26 Annual Action Plan
- INVESTOR ALERT: Pomerantz Law Firm Investigates Claims On Behalf of Investors of Gorilla Technology Group, Inc. - GRRR
- Rochester: Public Market seeks vendors for Flower City Days horticultural sales
- City of New Rochelle to Host Sustainability Community Events During Earth Week and Beyond
- SutheDermal.com Launches: Revolutionizing Comfort in Self-Injection Therapies
- Local Commitment, National Expansion
- Strengthening Financial Cybersecurity with RFA's Advanced Dashboard
- RFA's Cybersecurity Dashboard: Enhancing Financial Sector Security Management
- INVESTOR ALERT: Pomerantz Law Firm Reminds Investors with Losses on their Investment in Semtech Corporation of Class Action Lawsuit and Upcoming Deadlines - SMTC
- Barbaresco, Elegance Defined, is a Wine of Finesse
- S2C and Andes Technology Announce FPGA-Based Prototyping Partnership to Accelerate Advanced RISC-V SoC Development
- CCHR Florida to Host a Veteran Advocates Networking Event
- Students Celebrate Earth Month and Learn About the Lifecycle of Trees
- Veritas Arts Launches Bold Film and TV Slate with Bitcoin-Backed Financing
- Earth Day Gets Bloody in Brooklyn with Satirical Short Film: Don't Litter in Prospect Park!!
- Invenio IT Unveils Comprehensive Hurricane Disaster Recovery Plan for 2025
- INVESTOR DEADLINE APPROACHING: Faruqi & Faruqi, LLP Investigates Claims on Behalf of Investors of Atkore
- DivsFeed.com Launches: Digital Magazine Spotlighting Human Integrity, Connection, and Impact
- Electives Appoints DraftKings' CPO Linda Aiello to Board Amid Record Quarter
- Greenstein & Pittari, LLP Successfully Secures Compensation for Dog Bite Victim